Selasa, 02 November 2010

[U198.Ebook] Ebook Electronic Materials Handbook: Packaging, Volume I (Electronic Materials Handbook, Vol 1), by Merrill L. Minges

Ebook Electronic Materials Handbook: Packaging, Volume I (Electronic Materials Handbook, Vol 1), by Merrill L. Minges

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Electronic Materials Handbook: Packaging, Volume I (Electronic Materials Handbook, Vol 1), by Merrill L. Minges

Electronic Materials Handbook: Packaging, Volume I (Electronic Materials Handbook, Vol 1), by Merrill L. Minges



Electronic Materials Handbook: Packaging, Volume I (Electronic Materials Handbook, Vol 1), by Merrill L. Minges

Ebook Electronic Materials Handbook: Packaging, Volume I (Electronic Materials Handbook, Vol 1), by Merrill L. Minges

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Electronic Materials Handbook: Packaging, Volume I (Electronic Materials Handbook, Vol 1), by Merrill L. Minges

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness. Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

  • Sales Rank: #2588769 in Books
  • Published on: 1989-11-01
  • Ingredients: Example Ingredients
  • Original language: English
  • Number of items: 1
  • Dimensions: 11.25" h x 9.00" w x 2.50" l, .0 pounds
  • Binding: Hardcover
  • 1224 pages

Most helpful customer reviews

1 of 1 people found the following review helpful.
A classic book, well worth the price.
By Tate S.
This book IS the authoritative reference on all things electronic (IC's, PWB, assembly, reliability, etc.). This book was published in ~1989, so it may be dated for some readers, but an update has not been released since. I recommend this book for any electronic manufacturing designer / engineer interested in the science of electronic design, manufacture, and analysis.

0 of 0 people found the following review helpful.
great reference for anyone involved in the design and manufacture of electronics
By Tom terlizzi
This handbook is a compendium of useful information on just about every topic in the manufacturing of electronics for anyone involved in electronic packaging.
Extensive details in all aspects of electronic packaging is discussed in great detail from semiconductor fabrication, semiconductor assembly, pwb, hybrid, MCM, and flip chip. This handbook is an excellent starting point for someone new to the industry or veterans looking for references on specific topics.
The handbook not only includes electronic materials data but electronic design information.

I recommend it to my attendees for an IMAPS webinar I just presented in December 2013.
While much of the material is circa 1990, it still is applicable to the basics of today’s electronic packaging.
I wish the ASM would follow up with a new and updated version and generate a Volume II.
If you have any questions see my web site
[...]
Thanks
Tom

See all 2 customer reviews...

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